![]() Please refer to product section for more information. Note: Not all of C&K products have been tested to this profile. Thermal profile done 2 times on each part listed.Maximum time above 183☌ for 60 seconds.Reflow at a maximum of 245☌ for 10 seconds.In reflow soldering, a sufficient amount of heat melts the solder and forms joints without causing any damage to components or the circuit board. ![]() Pre-heat to a maximum of 200☌ for 30 seconds A typical reflow profile consists of four stages that include preheating, thermal soak, reflow, and cooling zones.to increase the process window soak temperature to 155-200C. To maintain a soak profile this would be changed as indicated in Figure 1. Thermal profile in accordance with CEI 6 / EN 6 Below (Figure 2.) is a view of a reflow soak profile commonly used for lead-free solder manufacturing.All trademarks are the property of their respective owners. Precision analog devices that may be sensitive to thermal mechanical stresses are not recommended for wave solder immersion. Thermal profile done 2 times on each part tested All other packages and lead types are not recommended.SMT Reflow Soldering Profile of Reference A balance of ductility and rigidity in a solder alloy needs to be achieved in order to have a reliable solder joint for high reliability under a wide service temperature environment1. Do not immerse or spray the unsealed areas of the switches with cleaners during flux removal. Solder time is approximately 3 seconds maximum. Download scientific diagram Typical reflow thermal profile from publication: Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process. The RPI automatic profiling system will automatically collect the thermal data at the board level for precise process control and allow traceability for every board that has been through reflow with the actual thermal profile, SPC, and Cpk stored for every board. Hand soldering and cleaning are acceptable with properly trained personnel, small diameter solder (.030-.040 in.) and low wattage soldering irons (25-40 watts max.). Care during soldering and cleaning can prevent most process contamination problems encountered.Ĭontamination can occur in both hand soldering and machine soldering processes. Switches may become intermittent, especially in low power applications, and may become open during factory testing or later in the field. Most manufacturing and field problems experienced by users of unsealed switches are caused by contamination of the internal switch contacts during soldering and cleaning processes.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |